The Role
We are looking for a Senior PCB Design Engineer with strong EDA library ownership and advanced high-speed board design experience to drive the implementation of our next-generation data center accelerator platforms.
In this role, you will be responsible for the complete PCB design process, from library definition and design rules, through floorplanning, routing, and tape-out, while collaborating closely with Signal Integrity (SI) and Power Integrity (PI) experts to define layer stacks, PDN strategies, and constraints.
This is a hands-on, technically demanding role focused on very high-density, high-layer-count boards, pushing the limits of power delivery, memory integration, and high-speed interfaces, using Siemens Xpedition as the primary design environment.
Key Responsibilities
- Design and layout complex, high-layer-count PCBs for accelerator and data center platforms
- Own and maintain EDA libraries (symbols, footprints, padstacks, constraints)
- Define routing constraints and complex design rules for high-speed and high-power designs
- Collaborate with SI/PI teams on layer stack-ups, impedance control, and PDN design
- Collaborate with mechanical and thermal experts to ensure design integration
- Drive designs from concept through tape-out, including manufacturing deliverables
- Support DFM reviews, board bring-up, and hardware debug activities
Required Qualifications
- Bachelor’s and Master’s degree in Electrical Engineering or related field.
- 5+ years of hands-on PCB layout experience in complex hardware programs.
- Strong experience with Siemens Xpedition (layout and library tools strongly preferred).
- Proven background designing high-speed, high-layer-count boards.
- Solid understanding of:
- Signal Integrity and Power Integrity fundamentals
- Controlled impedance routing
- High-density interconnects and advanced packages
- Experience creating and maintaining EDA component libraries.
- Ability to work effectively with cross-functional teams (SI, PI, schematic, ME, manufacturing).
Preferred Qualifications
- Experience with data-center, accelerator, networking, or HPC hardware.
- Direct involvement in memory subsystem integration and high-speed serial interfaces.
- Familiarity with SI/PI simulation workflows and constraint-driven design.
- Experience defining layer stacks in collaboration with fabricators and SI/PI teams.
- Knowledge of DFM/DFT/DFX principles for high-volume and advanced PCB manufacturing.
- Comfortable working in fast-moving, technically ambitious engineering environments.
What do we offer?
- Join an innovative team and experience company growth.
- We believe in investing in our employees and providing them with the opportunities they need to grow and develop their careers.
- Enjoy a hybrid work environment.
- We also offer flexible schedule.
- We offer a remuneration that values your experience.
- The position will have preferably the base in Karlsruhe (Germany).
We are looking for outstanding people willing to join our mission to change this industry and help to build a better world.
If you feel identified with Openchip, please contact us. We can offer a competitive compensation package in a flexible work schema that will help you to keep a balance between your personal and professional life.
At Openchip & Software Technologies S.L., we believe a diverse and inclusive team is the key to groundbreaking ideas. We foster a work environment where everyone feels valued, respected, and empowered to reach their full potential – regardless of race, gender, ethnicity, sexual orientation, or gender identity.
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